【摘要】 以WF6为前驱体,采用化学气相沉积法(CVD)在纯铜基体上沉积出钨涂层。利用光学显微镜(OM)和扫描电镜(SEM)分析研究钨制品组织缺陷的形成。结果表明:反应物浓度起伏对化学气相沉积钨的显微组织具有显著影响。当n(WF6):n(H2)≥1:3时,沉积物为柱状晶组织;当n(WF6):n(H2)<1:3时,该沉积层晶粒明显细化,显微组织为细晶层状结构。另外,沉积过程中杂质形状也显著影响沉积层的显微组织。当基体表面存在一维杂质时,沉积制品表面产生明显的凸起,严重影响制品的表面质量和显微组织的均匀性;当沉积过程中存在零维杂质时,沉积层出现放射状的组织结构。更多还原

【Abstract】 Tungsten coatings were deposited on pure copper substrates using WF6 as the precursor by chemical vapor deposition(CVD) method. The formation of the microstructure defects of the tungsten deposits was analyzed by OM and SEM. The results show that the reactant concentration fluctuation has a significant impact on the microstructure of tungsten prepared by CVD method. When n(WF6):n(H2)≥1:3, the microstructure of tungsten is columnar grain; when n(WF6):n(H2)<1:3, the grains of the deposited layer are refined and the microstructure presents a fine grains multilayer structure. Moreover, the shapes of the impurities can also influence significantly on microstructure of the layer. When there is one-dimensional impurity on the surface of substrate, the surface of deposition has obvious bulge, which seriously affects the deposits surface quality and microstructure uniformity; when there is zero dimensional impurity during the deposition process, the deposit appears radial structure.更多还原