【摘要】 采用磁控溅射方法制备了调制周期为3~200nm的Cu/Ru金属纳米多层膜。在通过X线衍射(XRD)和透射电子显微镜(TEM)对多层膜微结构结构进行系统表征的基础上,采用纳米压痕仪和扫描电子显微镜(SEM)研究了不同调制周期下Cu/Ru多层膜的压痕形貌。实验结果表明,调制周期大于8nm时,Cu/Ru多层膜的压痕尖端形成径向裂纹,而在调制周期小于8nm时,Cu/Ru多层膜的压痕周围出现外围剪切带。结合微结构表征,从界面结构演化的角度对实验结果进行了分析讨论。随着调制周期的减小,多层膜界面结构演化成共格界面,从而为位错的滑移提供条件,产生剪切带的同时抑制了裂纹的产生。更多还原

【Abstract】 Cu/Ru multilayers with a wide range of modulation period from 3to 200 nm were deposited by d.c.sputtering deposition.X-ray diffraction(XRD)and transmission electron microscopy(TEM)were carried out to investigate the impress appearance of the multilayer texture and microstructure.Nanoindentation testing was conducted to evaluate the shear banding deformation,and the morphologies of the residual indentations for the multilayers with different modulation period were examined by scanning electron microscope(SEM).Experimental results indicated that radial cracks appeared at indentation tips in the Cu/Ru multilayers when modulation period was larger than 8nm,while shear banding deformation appeared around the indentations in the Cu/Ru multilayers when modulation period was smaller than 8nm.Based on microstructure characterization,the experimental results were discussed based upon interface structure evolution.Along with the decrease of modulation period,coherent interfaces forms,which provides the chance for dislocation activities and leads to formation of shear band instead of crack.更多还原