【摘要】 通信、汽车、医疗、工业、军事和宇航应用对电子系统高性能、高密度,高可靠的要求正在并继续对电子封装工程师提出挑战。这种挑战使得多芯片模块(MCM)成为必然的选择。这是由于多芯片模块不仅可以提高系统的封装密度,而且可以成数量级地提高系统的可靠性及其电气、散热和密封性能。多芯片模块现在采用的有机层压板(MCM-L)、陶瓷(MCM-C)和沉积薄膜(MCM-D)的封装技术。其中尤以陶瓷封装技术—LTCC技术相对于其它封装技术显示出更巨大的魅力。它的优异的高频性能、散热性能和密封性能、可靠性和经济性使其成为无线通信、汽车电子、医疗电子和军事宇航应用的首选封装技术。展现了美好的技术和市场前景。本文介绍了LTCC技术的现状及其成为陶瓷型多芯片模块主导封装技术的令人振奋的新发展。描述了工业界对其的接收和认可。勾画了该技术巨大的市场潜力。更多还原

【Abstract】 Applications on communication,automotive,medical,industry,military and aerospace requires electronic system high performance,high packing density and high reliability,which are and will still be big challenges for electronic packaging engineer.The challenges make multi chip module(MCM)an inevitable choice.This is due to the MCM can improve not only the packaging density,but also the reliability,the electrical performance,the heat dissipation and the sealing performance of the systems greatly.MCM is now used in organic laminate(MCM-L),ceramic(MCM-C)and deposition film(MCM-D)packaging.Low temperature co-fired ceramic(LTCC)packaging technology shows much more attraction when compared with others for its excellent high frequency performance,sealing performance,heat dissipation,as well as reliability and economy,which makes it the preferred packaging technology for wireless communication,automotive electronics,medical electronics,military and aerospace applications,indicating it has agood technology and market prospects.This paper introduces the present situation of LTCC and the new development of it being the dominated technology in ceramic MCM.The acceptance and recognition of LTCC technology from industry indicate it an enormous marketing potential.更多还原