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Plastic characterization and performance of SnAgCuBiNi/Cu lead-free BGA solder joints

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【作者】 杨淼森； 孙凤莲； 孔祥霞；

【Author】 Yang Miaosen;Sun Fenglian;Kong Xiangxia;School of Material Science and Engineering,Harbin University of Science and Technology;Harbin Vocational and Technical College;

【机构】 School of Material Science and Engineering,Harbin University of Science and Technology； Harbin Vocational and Technical College；

【摘要】 Nanoindentation test is performed on study the plastic and creep properties of the Sn-Ag-Cu(SAC) lead-free ball grid array(BGA) solder joints.The dynamic hardness of two kinds of solder joints decreases with indentation depth increase.SAC0705BiNi/Cu exhibits a higher ultimate dynamic hardness and a smaller indentation depth than SAC305/Cu.Then the strain hardening phenomenon of SAC305/Cu is more obvious compared to that of SAC0705BiNi/Cu.The indentation creep of SAC0705BiNi/Cu solder joint is lower than that of SAC305/Cu solder joint before and after thermal shock.The creep rate sensitive index of SACBiNi/Cu solder joint is lower than that of solder joint.SAC0705BiNi/Cu solder joint is superior to SAC305/Cu solder joint in the anti-creep property.The plasticity of SAC0705BiNi/Cu and SAC305/Cu solder joints are similar.Compared with SAC305 solder,the SAC0705 BiNi solder performs higher hardness and solder creep resistance and still maintains a good plasticity.

【Abstract】 Nanoindentation test is performed on study the plastic and creep properties of the Sn-Ag-Cu(SAC) lead-free ball grid array(BGA) solder joints.The dynamic hardness of two kinds of solder joints decreases with indentation depth increase.SAC0705BiNi/Cu exhibits a higher ultimate dynamic hardness and a smaller indentation depth than SAC305/Cu.Then the strain hardening phenomenon of SAC305/Cu is more obvious compared to that of SAC0705BiNi/Cu.The indentation creep of SAC0705BiNi/Cu solder joint is lower than that of SAC305/Cu solder joint before and after thermal shock.The creep rate sensitive index of SACBiNi/Cu solder joint is lower than that of solder joint.SAC0705BiNi/Cu solder joint is superior to SAC305/Cu solder joint in the anti-creep property.The plasticity of SAC0705BiNi/Cu and SAC305/Cu solder joints are similar.Compared with SAC305 solder,the SAC0705 BiNi solder performs higher hardness and solder creep resistance and still maintains a good plasticity.

【关键词】 ball grid array solder joint； creep resistance； plasticity； nanoindentation；
【Key words】 ball grid array solder joint； creep resistance； plasticity； nanoindentation；
【基金】 supported by National Natural Science Foundation of China(Grant No.51174069 and 51075107);Research Special Funds for Technology Creative Talents of Harbin(Grant No.2013RFQXJ166)
  • 【文献出处】 China Welding ,中国焊接(英文版) , 编辑部邮箱 ,2015年03期
  • 【分类号】TG44
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