【摘要】 研究了电流密度对超薄电解铜箔的组织与性能的影响。结果表明,铜箔毛面的晶粒尺寸、粗糙度随电流密度的增大而增大。电流密度的增大,有利于(111)和(220)晶面的快速生长,但随着电流密度的进一步增大,(220)晶面的生长速度明显快于(111)晶面,最终(220)晶面生长占优。抗拉强度和伸长率受到尺寸效应影响。(111)织构能提升铜箔的抗拉强度;(220)织构会降低铜箔的抗拉强度,但提高铜箔的伸长率。当电流密度超过一定程度时,铜箔会出现"过烧"、"粉化"现象,导致铜箔伸长率、抗拉强度显著下降。更多还原

【Abstract】 Aiming at non-steady production process for ultra-thin electrolytic copper foil,effects of current density on microstructure and properties of copper foil were investigated.The grain size and roughness of copper foil matt surface are increased with increasing in current intensity.The increase of current density is beneficial for the growth of(111)and(220)crystal face,however,the growth rate of(220)crystal face is faster than the(111),finally,the(220)crystal face is dominant in growth with increasing in current density continuously.Tensile strength and elongation are related with size effect,and(111)texture can improve tensile strength of the copper foil,while(220)texture can decrease the tensile strength of copper foil and improve the elongation.When the current intensity is increased to a certain extent,the copper foil can be burned and powdered,leading to the deterioration of the tensile strength and elongation.更多还原