【摘要】 采用硫氰酸盐—双氧水浸金体系从废电路板中回收金和银,详细考察了硫氰酸盐浓度、双氧水浓度、溶液pH、固液比、温度和搅拌速度等对金银浸出率的影响。结果表明,在0.05 mol/L H2O2、0.4mol/L SCN-、固液比1/250、搅拌速度200r/min、室温(~15℃)浸取8h的条件下,金、银浸出率分别超过90%和79%,铅浸出率为9.7%。更多还原

【Abstract】 Gold and silver were recovered from waste printed circuit boards in thiocyanate-hydrogen peroxide systems.The effects of thiocyanate concentration,hydrogen peroxide concentration,pH value of solution,ratio of solid to liquid(S/L),temperature and stirring speed on leaching rates of Au and Ag were investigated.The results show that leaching rates of Au,Ag and Pb are 90% above,79% above,and9.7%,respectively under the optimum conditions including H2O2 concentration of 0.05 mol/L,thiocyanate concentration of 0.4mol/L,S/L=1/250,stirring speed of 200r/min,room temperature(~15 ℃)and leaching time of 8h.更多还原