With the increase of wafer diameter,small lot size and multi-product manufacturing,there were more and more switches between transient processes and steady states.To meet the requirements of large wafer manufacturing and to improve the machining performance of cluster tool,the research for transient processes of dual-arm cluster tools in wafer fabrication with wafer revisiting was meaningful.Since there was no buffer between the process modules in a cluster tool,it was difficult to schedule a cluster tool.B...