【摘要】 研究了一种简化预处理辅助化学镀工艺制备Cu包覆Ti C复合粉末。利用场发射扫描电子显微镜和能谱仪分析了原始Ti C粉末,预处理之后的Ti C粉末,Cu包覆Ti C复合粉末的表面形貌和成分,同时也阐述了Cu镀层的生长机理。结果表明,经过简化预处理之后的Ti C出现了很多表面缺陷,Cu能够均匀的包覆在Ti C颗粒表面。其生长机理如下:经过预处理之后的Ti C出现很多表面缺陷,成为化学镀过程中的活性点;化学镀过程中,Cu在Ti C表面的各个缺陷处形核长大;Cu与Cu之间相互接触相互作用形成密集的网状结构最终形成致密的Cu镀层。更多还原

【Abstract】 Copper( Cu)-coated titanium carbide( TiC) composite powders were synthesized by electroless plating with a simplified pretreatment. The surface morphology and composition of the initial TiC powders,pretreated TiC powders and Cu-coated TiC powders were analyzed by field emission scanning electron microscopy,and energy dispersion spectrometry. The growth mechanism of Cu layers was also discussed. The results show that uniform Cu-coated TiC composite powders are successfully synthesized without conventional sensitization and activation steps by ultrasonic electroless plating after a simple pretreatment. The growth mechanism of Cu layers appears as follows: the surfaces of pretreated TiC powders appear surface defects which act as activated sites. Nucleation and the growth of copper grains take place on the activated sites of the pretreated TiC powder,and the process repeats continuously on the lath particles with reticulate structure on the as-coated surfaces of previously deposited Cu-cells,finally Cu cells grow up and merge into a layer.更多还原