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铝基Al2O3纳米多孔表面大容积池沸腾实验
Experimental study on pool boiling of aluminum base Al2O3 nano-porous surface
【摘要】 目前微电子器件不断地向高密度、微型化、功能化方向发展,散热问题是制约技术进一步发展的瓶颈。本文拟利用纳米多孔表面优良的相变传热特性,解决电子器件微型化散热难的问题。文中以铝基Al2O3纳米多孔薄膜为传热表面,以去离子水为工质,常压下对其大容积池沸腾下的传热性能进行了实验研究。实验结果表明:与光滑表面相比,Al2O3纳米多孔表面在核态沸腾时汽化核心密集,产生汽泡体积小、数量多并能提高铝基传热表面的传热系数2~5倍,且能够在长时间内维持其较高的传热系数;以纳米多孔表面作为传热表面,可以有效降低微电子原件表面温度3~5℃,在核态沸腾阶段能够降低30℃以上,很好地起到了降低电子元件表面温度的作用。实验结果对微电子冷却有重要的参考作用。
【Abstract】 The problem of heat dissipation is the bottleneck for the further development of micro-devices because the high density,microminiaturization and functional systemic. In this paper,Nano-porous surfaces’ excellent phase change heat transfer characteristics were analyzed to solve this problem. An experimental study on the pool boiling heat transfer performance of the aluminum base Al2O3 nano-porous film was conducted with water under normal pressure. Experimental results showed that Al2O3 nano-porous surface improved the heat transfer coefficient of the aluminum heat transfer surfaces 2—5 times compared with the smooth-surfaced devices,and could maintain high heat transfer coefficient in a long time,because the intensive vaporized core could produce large amount of small bubbles. The surface temperature of microelectronic could be effectively decreased by 3—5℃,even by more than 30℃ in nucleate boiling stage with nano-porous surface as heat transfer surface.
【Key words】 porous media; heat transfer; alumina; polling boiling; electronic chip cooling;
- 【文献出处】 化工进展 ,Chemical Industry and Engineering Progress , 编辑部邮箱 ,2015年05期
- 【分类号】TK124
- 【被引频次】15
- 【下载频次】271