【摘要】 综合分析了Sn-Cu-Ni系无铅钎料的国内外研究现状,概述了Sn-Cu-Ni系无铅钎料的润湿性、微观组织、界面反应、力学性能、焊点可靠性、物理性能等性能特点。从钎焊工艺、添加微量元素等方面阐述了Sn-Cu-Ni系钎料各项性能的影响因素,并对Sn-Cu-Ni系钎料的应用前景和研究方向进行了展望。建议针对Sn-Cu-Ni钎料物理性能(如热导率、热膨胀系数、表面张力等)和相关设备、工艺开展研究,以促进Sn-Cu-Ni无铅钎料的应用。更多还原

【Abstract】 The research status of Sn-Cu-Ni solders was comprehensively analyzed,and the wettability,microstructure,interracial reaction,mechanical properties,joint reliability and physical property of Sn-Cu-Ni solders were discussed.The influencing factors of solder properties were summarized from soldering processes and trace elements addition.Furthermore,the application prospect and future research direction were also predicted.In order to promote the application of Sn-Cu-Ni solder,the physical properties and relative equipment,soldering process of Sn-CuNi solder should be studied.更多还原