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一种基于LTCC技术毫米波垂直互连过渡结构设计

A millimeter microwave vertical interconnect transition structure design based on LTCC technology

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【作者】 贾文强陈建荣

【Author】 JIA Wen-qiang;CHEN Jian-rong;Xi’an Space Radio Technology Research Institute;

【机构】 西安空间无线电技术研究所

【摘要】 为了实现微波毫米波多芯片组件的多层立体高集成度设计,提出Ka波段LTCC(Low Temperature Co-Fired Ceramic)微带到带状线穿透两层接地导体的正反向过渡结构。该结构采用类同轴和"水滴"匹配的方法,结合高频电磁软件仿真及测试实验,结果表明,该14层LTCC结构能实现良好传输的最高频率可达36 GHz,可实现Ka波段毫米波微带到内层带状线的灵活过渡。

【Abstract】 In order to realize the multilayer,three-dimensional,and highly integrated designing of MMCM(Microwave Multichip Module), a Ka-band LTCC(Low Temperature Co-fired Ceramic) microstrip to stripline front and back transition structure of penetrating through two layer grounding conductor is proposed.The structure uses the quasi-coaxial line and "water droplet shape" matching method, combining with the simulation of HFSS(High Frequency Structure Simulator) and measurement,the result indicate that the maximal frequency at which the 14 layers LTCC structure can transport electromagnetic wave well reach 36 GHz.It can be flexibly used to Ka-band millimeter microwave microstip to stripline transition.

  • 【文献出处】 电子设计工程 ,Electronic Design Engineering , 编辑部邮箱 ,2015年10期
  • 【分类号】TN405.97
  • 【被引频次】7
  • 【下载频次】312
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