【摘要】 采用化学包覆和粉末冶金法制备了新型Ag-CuO-La₂O₃电接触材料，研究了新材料的微观结构和性能。结果表明，细小的Cu O和La₂O₃颗粒高度弥散地分布于银基体中，新材料的密度为9.77 g·cm-3，电阻率为2.36μ?·cm，显微硬度（Hv0.2）为113。与相同工艺制备的Ag-SnO2传统电接触材料比较，新材料具有更好的室温加工性能、更优异的耐电弧侵蚀能力以及更长的电寿命。Ag-CuO-La₂O₃新材料有望成为一种替代传统Ag-SnO2的新型电接触材料。更多还原

【Abstract】 A new electrical contact material, Ag-Cu O-La₂O₃, was produced by chemical coating and powder metallurgy method, and its microstructure and performance were investigated. The results show that fine oxides of Cu O and La₂O₃ have a uniform distribution in the silver matrix. Its density, resistivity and micro-hardness（Hv0.2） is 9.77 g·cm^-3, 2.36 μ?·cm and 113 respectively. Compared with convenient Ag-Sn O2 electrical contact materials prepared by the same process, the new material has superior room temperature processing performance, better ability of anti-arc erosion and longer service life. The Ag-Cu O-La₂O₃ material may be substitute for Ag-Sn O2 as a new electrical contact material.更多还原