【摘要】 对用于大功率LED阵列的多孔微热沉的主动冷却方案展开了实验研究,实验结果表明在输入功率为45 W的情况下,不采用多孔微热沉换热时,LED芯片温度在两分钟时间内就升高到了70℃;在采用多孔微热沉后,在50s系统就到达稳定,而且温度仅为38.3℃,即使功率加大到75 W,温度也仅为42.5℃。对多孔微热沉结构进行数值分析,结果表明,优化后的结构能提高LED散热效果,并极大的改善了基板的温度均匀性,有利于LED寿命和性能的提高。更多还原

【Abstract】 A series of experiments on an active cooling system that used the porous micro heat sink for thermal management of high power LED(light emitting diode) arrays had been conducted.The experimental results showed that in case of the LED power input of 45 W,the LED chip temperature raised up to 70℃ in two minutes without the porous micro heat sink.When the heat sink was used,the system reached stability in 50 seconds and the temperature was only 38.3℃.Even though the input is increased to 75 W,the temperature is merely 42.5℃.Numerical analysis on porous micro heat sink was conducted,the results indicated that the optimal structure could enhance the effect of heat dissipation and improved the temperature uniformity on the substrate,which is beneficial to the improvement of the life and performance of LED.更多还原