【摘要】 针对以次磷酸钠为还原剂的印制线路板(PCB)化学镀铜体系,探讨了络合剂乙二胺四乙酸二钠(EDTA·2Na)和酒石酸钾钠对次磷酸钠化学镀速和镀液稳定性的影响,使用线性扫描和循环伏安法研究其电化学行为。结果表明,EDTA·2Na和酒石酸钾钠均能稳定化学镀铜液,改善镀层质量,前者降低化学镀速,后者对化学镀速先增大后降低,其适宜浓度分别为12和9.6 g/L。随着络合剂EDTA·2Na浓度增加,铜阴极还原峰电流逐渐减小,次磷酸钠阳极氧化影响不明显。随着酒石酸钾钠浓度增加,铜阴极还原峰和次磷酸钠阳极氧化峰电流均先增大后减小。更多还原

【Abstract】 The influence of complex agents(edetate disodium, potassium sodium tartrate) on the stability of the bath containing sodium hypophosphite and the electroless Cu-plating rate was investigated. Then, the electrochemical properties of the Cu- coating were examined by means of linear sweep and cyclic voltammetry. The results show that with addition of EDTA·2Na, the cathodic reduction peak current increases and the anodic oxidation peak current changes less; with the increase of potassium sodium tartrate the cathodic reduction peak current and anodic oxidation peak current first increases and then decreases; both of EDTA·2Na and potassium sodium tartrate can improve the stability of electroless plating bath and the quality of Cu coatings, of which the former reduced, while the later increased initially and then decreased the plating rate; correspondingly the appropriate dosages are 12 and 9.6 g/L, respectively for the two complex agents.更多还原