【摘要】 以PCB片式电阻器件无铅焊点为研究对象,开展与有铅焊点剪切力-热疲劳状态比较试验研究。采用了伪失效寿命比较方法,获得了有限周期温度冲击下的焊点剪切力试验数据,采用非线性最小二乘法进行剪切力数据的曲线拟合。结果表明,封装尺寸是影响焊点热疲劳性能的重要因素。在1 500个有限周期内,无铅焊点的热疲劳性能优于有铅焊点。更多还原

【Abstract】 Shear force-thermal fatigue state conferring test studies on lead-free solder joints of PCB chip resistor and lead solder joints were conducted.The shear force experiment data in limited temperature cycles was obtained by using comparing method based on pseudo failure life.Shear force test data curves were fitted by using nonlinear least square method.The results indicate that the size of package is an important factor to thermal fatigue property of solder joints,lead-free solder joints’ thermal fatigue performance is better than that of lead solder joints in limited 1 500 cycles.更多还原