【摘要】 微电子塑封器件常用的环氧树脂塑封料,因其极易吸收周围环境里的水汽而严重影响塑封器件的可靠性。通过一个实例分析,分别从故障定位、机理讨论以及改进措施3个方面对塑封器件分层失效进行详细的论述,从而有效而快速地提升塑封器件可靠性。更多还原

【Abstract】 Microelectronics plastic devices commonly used epoxy molding compound, its easy to absorb water vapor in the surrounding environment and seriously affect the plastic device reliability. through a case study, the delamination of plastic packaging device was discussed from the fault location, failure mechanisms and the improvement measures in detail.thus,Effectively and quickly to enhance the reliability of plastic devices.更多还原