【摘要】 为了满足超大规模集成电路和微机电系统的金属化要求,以氨水–苹果酸为复配位剂,在二氧化硅基体表面进行了化学镀银–钨合金的工艺研究。考察了硝酸银、水合肼、氨水、苹果酸、钨酸钠和乙二胺四乙酸二钠的浓度对镀层质量的影响,确定了它们的最佳值分别为0.030、0.009、1.30、0.15、0.03和0.020 mol/L。此条件下的镀速为60 nm/min。采用X射线衍射仪(XRD)、能谱仪(EDS)和扫描电镜(SEM)分别对镀层的结构、元素组成和表面形貌进行了表征,测试了镀层的显微硬度、结合力、耐蚀性及退火前后的电阻率。结果表明,所得50、100、150和200 nm厚的镀层均表面平整光滑,致密度好,结合力强,耐蚀性好,其中100 nm厚的Ag–W镀层钨含量最高(原子分数为0.89%),显微硬度最高(为1 350 MPa),电阻率较低(为4.20×10-8?·m)。更多还原

【Abstract】 A process for electroless plating Ag–W alloy on silica with ammonia and malic acid as complexing agents was studied to meet the metallization requirements of ultralarge-scale integration and microelectromechanical systems. The effects of the concentrations of silver nitrate, hydrazine hydrate, ammonia water, malic acid, sodium tungstate, and disodium ethylenediaminetetraacetate on the quality of Ag–W coating were discussed and their optimal values were determined to be 0.030, 0.009, 1.30, 0.15, 0.03, and 0.020 mol/L, respectively. The deposition rate was measured as 60 nm/min under the above conditions. The microstructure, elemental composition, and surface morphology of the Ag–W alloy coating were characterized by X-ray diffractometer(XRD), X-ray spectrometer(EDS), and scanning electron microscope(SEM), respectively. The microhardness, adhesion strength, corrosion resistance, and resistivity before and after annealing of the coatings were tested. The results showed that the 50, 100, 150, and 200 nm-thick Ag–W coatings has a level, smooth, compact, well-adhered, and corrosion-resistant surface. The Ag–W coating with a thickness of 100 nm has the highest tungsten content(0.89at%), largest microhardness(1 350 MPa), and a relatively low resistivity(4.20 × 10-8 ?·m).更多还原