【摘要】 在低温下,利用Ag箔作中间层对Ti-6Al-4V钛合金(TC4)和无氧铜(OFC)进行了扩散焊接。结果表明Ag箔中间层阻止了Ti-Cu金属间化合物的生成,改善了TC4/OFC焊接接头的界面组织结构和焊接强度。同时,Ag箔中间层的添加也降低了TC4/OFC接头的焊接温度。焊接界面从TC4侧到OFC侧依次是TC4基体,AgTi金属间化合物,Ag中间层,Ag-Cu固溶体和OFC基体。在工艺条件:T=700℃,P=10 MPa,t=60 min下,TC4/Ag/OFC焊接接头的抗拉强度为150 MPa,其值高于直接焊接时的抗拉强度。焊接接头断裂发生在Ag/OFC界面,并且呈韧性断裂。我们可以推测AgTi化合物的韧性性能优于Ag-Cu固溶体。更多还原

【Abstract】 Diffusion bonding of Ti-6A1-4V(TC4) to oxygen free copper(OFC) at low temperature was carried out using silver foil as interlayer.Results show that the interlay can prevent the formation of brittle Ti-Cu compounds and improve the interfacial microstructure and bonding strength of the TC4/OFC joint.Moreover,adding the silver interlayer greatly lowers the bonding temperature.The composition of the joint from the TC4 side to the OFC side is TC4 substrate,AgTi compound,Ag interlayer,Ag-Cu solid solution and OFC substrate.The tensile strength of the joint bonded at 700 ℃ for 1 h under 10 MPa bonding pressure has an excellent value of 150 MPa,higher than those previously reported in literatures.Fracture failure takes place in the Ag/OFC interface and ductile fracture can be observed on the fracture surface.It is suggested that the ductile properties of the AgTi compounds are superior to that of Ag-Cu solid solution in this joint.更多还原