Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

【摘要】 A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks.Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software.Owing to the increased effective cooling area,this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks.Owing to the lower flow velocity in this novel high efficient cooling structure,the chillers’ water-pressure requirement is reduced.Meanwhile,the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low,it also has advantages in terms of high durability and long lifetime.This heat-sink is an ideal choice for the package of high power density laser diode array stacks.更多还原

【Abstract】 A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks.Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software.Owing to the increased effective cooling area,this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks.Owing to the lower flow velocity in this novel high efficient cooling structure,the chillers’ water-pressure requirement is reduced.Meanwhile,the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low,it also has advantages in terms of high durability and long lifetime.This heat-sink is an ideal choice for the package of high power density laser diode array stacks.更多还原