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MgO/Au复合薄膜的反应射频磁控溅射法制备及表面形貌研究

Synthesis and Characterization of Microstructures of MgO /Au Composite Films Grown by Reactive RF Magnetron Sputtering

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【作者】 李亨胡文波吴胜利魏强

【Author】 Li Heng;Hu Wenbo;Wu Shengli;Wei Qiang;Key Laboratory of Physical Electronics and Devices of Ministry of Education,Xi’an Jiaotong University;

【机构】 西安交通大学电子物理与器件教育部重点实验室

【摘要】 采用反应射频磁控溅射法制备MgO/Au复合薄膜,并对使用Mg靶和Au靶共溅射、分步溅射方式以及在不同的衬底温度和Ar/O2气体流量比下制备的样品进行X射线光电子能谱、X射线衍射和扫描电子显微镜分析,研究了主要工艺参数对复合薄膜表面成分和形貌的影响。结果表明,采用共溅射方式制备的复合薄膜中Au元素的含量偏高,薄膜表面有团聚生长的Au晶粒,而采用分步溅射法可以使复合薄膜中Au元素的摩尔百分比下降到7.30%。采用分步溅射制备复合薄膜时,较高的衬底温度有助于MgO晶粒的生长,当衬底温度为500℃,通入Ar气和O2气的流量分别为25和5 mL/min时,MgO晶粒尺寸达到了30~40 nm;MgO薄膜主要呈现出了(111)、(200)和(220)三种结晶取向,较高的Ar/O2气体流量比有利于(200)晶向的形成,而较低的Ar/O2气体流量比有利于(220)晶向的形成。

【Abstract】 The MgO /Au composite thin films were synthesized by reactive RF magnetron sputtering on n-type Si( 100) substrate. The influence of the growth conditions on the microstructures of the MgO /Au films was evaluated. The MgO /Au films were characterized with X-ray diffraction,X-ray photoelectron spectroscopy,and scanning electron microscopy. The results show that the growth conditions,particularly the substrate temperature,ratio of Ar /O2 gas flow rates,and sputtering modes( co-sputtering and step-by-step sputtering),have a major impact on the MgO /Au film growth. For example,co-sputtering mode resulted in formation of Au grains on the MgO /Au surfaces because of Au fast deposition rate,but step-by-step sputtering mode reduced the Au content to a mole ratio of 7. 30%.Besides,high substrate temperature promoted MgO grain growth. Deposited in a step-by-step sputtering mode at a substrate temperature of 500℃ and a ratio of Ar /O2 gas flow rate of 5. 0,the MgO grains with a size about 30 ~ 40 nm formed. Depending on the ratio of Ar /O2 flow rate,three preferred growth orientations:( 111),( 200),and( 220),were observed.

【基金】 国家自然科学基金资助项目(61275023,51271140);西安交通大学“中央高校基本科研业务费”资助项目(xjj20100158)
  • 【文献出处】 真空科学与技术学报 ,Chinese Journal of Vacuum Science and Technology , 编辑部邮箱 ,2014年08期
  • 【分类号】O484.1
  • 【被引频次】4
  • 【下载频次】212
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