【摘要】 提出了一种用于铁氧体电感金属化的耐高温薄膜。它采用了Ni-V/Ag复合膜系,能够满足贴片电感组装过程中耐受420℃高温焊接10 s的要求,而且厚度不超过6μm。为了了解焊接中的表面反应过程,用扫描电镜、能量色散X射线光谱仪对不同参数焊接膜层的微观形貌和成分进行了分析测量。结果显示在250℃时金属件化合物主要是(Cu,Ni)6Sn5,而在420℃时则是以(Ni,Cu)3Sn4为主,焊接时的高温能极大地改变表面反应的速率和产物,同时证明所述膜层能达到设计要求。更多还原

【Abstract】 The Ni-V/Ag composite films,with high temperature resistance,were deposited by magnetron sputtering on substrate of ferrite inductors.Since the surface mounting of ferrite inductor requires a chip thickness about6μm and a high temperature(420℃)heatingforatleast10 s to burnoutcladdingofCuwire,metallizationof the Ni-V/Ag composite filmsmay be agood solution.The impactsof the soldering conditionson the microstructuresof the junctionwere evaluated. The microstructures and phase structures of the Ni-V/Ag composite films,before and after soldering,were characterized with scanning electron microscopy,and energy dispersive spectroscopy.As the soldering temperature increased to 420℃, the dominant intermetallic compound(Cu,Ni)6Sn5phase,observed at 250℃,gradually turned into(Ni,Cu)3Sn4phase. Besides,high soldering temperature promotes favorable surface reactions.We suggestthatthe 5μmthickNi-V/Ag filmbe a good material for industrial production of ferrite inductors.更多还原