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新型耐高温无溶剂环氧胶粘剂的研制
Preparation of novel solvent-free epoxy adhesives with high-temperature resistance
【摘要】 采用DTGM53、DDRS3521这2种多官能环氧树脂,以低黏度的甲基四氢苯酐为固化剂,在促进剂E-24作用下,制备了综合性能优异的新型耐高温无溶剂环氧胶粘剂。同时,对该环氧胶粘剂的黏度、凝胶化时间、粘接性能、活化能等作了系统的研究。结果表明,该胶粘剂具有优异的高温拉伸剪切强度,200℃时高达16.1 MPa。
【Abstract】 Using both DTGM53,DDRS3521 polyfunctional epoxy resin,with a low viscosity curing agent,methyl tetrahydrophthalic anhydride,under the effect of promoter E-24,prepare a novel solvent-free epoxy adhesives with hightemperature resistance & superior comprehensive performance.At the same time,the viscosity gelation time,bond properties, activation energy of the epoxy adhesive,et al.was researched.Results show that this adhesive has excellent high temperature tensile shear strength up to 16.1 MPa at the 200℃.
【关键词】 环氧胶粘剂;
无溶剂;
耐高温;
制备;
【Key words】 epoxy adhesives; solvent-free; high-temperature resistance; preparation;
【Key words】 epoxy adhesives; solvent-free; high-temperature resistance; preparation;
- 【文献出处】 粘接 ,Adhesion , 编辑部邮箱 ,2014年01期
- 【分类号】TQ433.437
- 【被引频次】25
- 【下载频次】333