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含硅氮芳炔树脂的合成、表征及固化动力学
SYNTHESIS,CHARACTERIZATION AND CURING KINETICS OF SILICON-CONTAINING DIPROPARGYL ANILINE RESIN
【摘要】 以N,N′-二炔丙基苯胺和二甲基二氯硅烷为聚合单体,通过格式反应合成了含硅氮芳炔树脂,采用FTIR,1 H NMR表征其结构,利用DSC研究了含硅氮芳炔树脂的固化动力学,确定固化反应为一级反应,起始固化温度约为218℃。利用TGA分析了固化树脂的热性能,结果表明:含硅氮芳炔树脂在氮气中Td5为451℃,具有良好的耐热性。
【Abstract】 A novel silicon-containing dipropargyl aniline(DPAMS)was synthesized by Grignard reaction with dimethyl dichlorosilane and N,N′-dipropargyl-aniline(DPA)as raw materials.The structure was characterized by FT-IR and NMR.Curing kinetics of DPAMS resin was studied by means of differential scanning calorimetry(DSC).Curing reaction was identified as first order reaction with initial curing temperature as about 218℃.The cured resin possessed excellent high temperature-resistance properties with respect to the decomposition temperatures at 5% weight loss(Td5)451℃in N2.
【Key words】 silicon-containing dipropargyl aniline; differential scanning calorimetry; curing kinetics;
- 【文献出处】 精细石油化工 ,Speciality Petrochemicals , 编辑部邮箱 ,2014年05期
- 【分类号】TQ324.21
- 【被引频次】1
- 【下载频次】82