【摘要】 为研究等离子体刻蚀中静电吸盘绝缘层结构对晶圆温度分布均匀性影响,建立了晶圆与静电吸盘三维传热模型,采用中心组合设计方法分析了晶圆半径、进气带半径、进气孔半径、槽道深度、粗糙度最大轮廓五个结构变量对均匀性的影响,得到结构变量与均匀性的二次响应面方程。采用自适应进化算法对响应面方程优化,结果表明进气孔半径、槽道深度、粗糙度最大轮廓是最显著影响因素,响应面计算结果与仿真结果一致,该方法可用于静电吸盘的设计研发。更多还原

【Abstract】 The influence of electrostatic chuck’s structure on the temperature distribution uniformity of wafer is discussed. A 3D heat transfer model of wafer and electrostatic chuck is built,and central composite design method and self-adaptive optimization are used to analyze the critical structure variables on the uniformity. The results show that the radius of inlet hole, the depth of groove and the roughness are the most significant factors. Response surface calculation results agree with the simulation results,and the method can be used to the design research and development of electrostatic chuck.更多还原