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激光辐照诱导氧化铝陶瓷基板表面化学镀铜
Laser irradiation induced copper layer growth on alumina ceramic by electroless plating
【摘要】 采用激光辐照处理对Al2O3陶瓷基板进行预处理,经过超声波辅助化学镀在Al2O3陶瓷基板表面成功制备了化学镀铜层。利用场发射扫描电子显微镜(FE-SEM)和能谱(EDS)研究分析了激光辐照预处理前后Al2O3基板表面形貌和Al2O3基板化学镀铜表面以及截面形貌,划痕形貌,并与传统贵金属Pd活化预处理化学镀铜进行对比。试验结果表明:激光辐照处理后Al2O3基板表面出现了大量的微孔和纳米级颗粒凸起,这些表面缺陷易于吸附外来物质成键,实现化学镀铜过程,其中镀层与基底也有较好的结合力;与传统Pd活化预处理化学镀铜对比发现,激光辐照处理避免了繁琐的工艺和贵金属带来的污染,同时生成的化学镀铜层颗粒与颗粒之间融合更好。
【Abstract】 After the laser irradiation pretreatment and the ultrasonic assisted chemical plating,copper electroless plating was successfully prepared on Al2O3 ceramic substrate. The surfaces of the Al2O3 ceramic substrate before and after laser irradiation pretreatment and the electroless plating with the cross and scratches were analyzed by field emission scanning electron microscope( FESEM) and energy dispersive spectrometer( EDS). The comparison experiments with traditional pretreatment process were also discussed. Result shows:combinations of a large number of microvoid and nano granular heaves appear on the surfaces of the Al2O3 ceramic substrate. Foreign particles are easily absorbed on this morphology of surface defects to complete the electroless plating. The plating and the substrate are combined well. Compared with the traditional process,the proposed one can avoid complicated procedures and the pollution from the noble metal‘Pd’. Moreover,the combination of the copper grains in the layer formed by the proposed process is considered to be better.
【Key words】 ceramic substrate; laser irradiation; electroless copper plating;
- 【文献出处】 材料热处理学报 ,Transactions of Materials and Heat Treatment , 编辑部邮箱 ,2014年10期
- 【分类号】TB306
- 【被引频次】5
- 【下载频次】413