【摘要】 不同Al含量(0.16%、0.3%和0.5%)的Cu-Al合金薄板使用Cu2O粉末包埋法内氧化,制备Cu-Al2O3弥散强化铜合金,并对其微观组织进行分析。结果表明,合金的内氧化层表层晶粒均比内部晶粒明显细小,表面晶粒为5~30μm,内部晶粒为30~100μm;随内氧化时间增加,内氧化层深增加,但随Al含量增加而减小;内氧化层的微观组织为大量细小γ-Al2O3相弥散分布在铜基体上;内氧化层表层γ-Al2O3粒子大小为20~50 nm,间距为50~150 nm,γ-Al2O3粒子与基体Cu的界面匹配关系是(022)Cu//(220)γ,为共格界面。更多还原

【Abstract】 Internal oxidation of Cu-Al alloy with different Al content( 0. 16% 、0. 3% and 0. 5%) was carried out in Cu2 O powder oxidizer. The microstructure of Cu-Al2O3 composites was investigated by metallurgical microscope and transmission electron microscope( TEM). The results show that after internal oxidation,the grains of surface layer of the alloy are smaller than that of inside layer. The surface grain size is 5-30 μm,while the inside grain size is 30-100 μm. Internal oxidation depth of the alloy increases gradually with increasing of oxidation time,but decreases with increasing of Al content. Lots of small γ-Al2O3 particles with diameter size of about 20-50 nm and particle spacing of 50-150 nm distribute dispersedly in Cu matrix. The two phases between γ-Al2O3 and Cu matrix have a semicoherent relationship of( 022)Cu/ /( 220)γ.更多还原