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电弧离子镀TiN工艺优化及TiN/TiC多层膜性能
Process optimization of TiN films deposited by arc ion plating and properties of TiN/TiC multilayer films
【摘要】 采用电弧离子镀技术制备TiN薄膜,研究了不同氮分压以及基体偏压下薄膜的表面质量、微结构、相组成、硬度以及结合力,优化工艺参数并制备TiN/TiC多层膜,比较了多层膜以及TiC单层膜的硬度以及摩擦性能的差异。结果表明,经过对不同工艺参数下薄膜的形貌结构以及性能比较,确定采用0.6 Pa氮分压以及-100 V基体偏压作为TiN优化工艺参数,在该工艺基础上制备的TiN/TiC多层膜与单层TiC薄膜相比具有更高的硬度以及更低的摩擦系数。
【Abstract】 TiN films were prepared by using multi-arc ion plating technique.The surface quality,microstructure,phase composition,hardness and cohesion of the films at different N2pressure and substrate bias voltage were analyzed in order to optimize the process.The results show that the TiN films have the optimum structure and performence at the N2pressure of 0.6 Pa and substrate bias voltage of-100 V,the TiN/ TiC multilayer film deposited by process mentions above has higher hardness and lower friction coefficient compared to the TiC film.
- 【文献出处】 材料热处理学报 ,Transactions of Materials and Heat Treatment , 编辑部邮箱 ,2014年04期
- 【分类号】TG174.4
- 【被引频次】9
- 【下载频次】266