【摘要】 研究了一种采用MEMS技术实现的含有红外发射源和探测单元的片上集成红外气体传感器芯片。通过理论分析证明了探测器和红外发射源可以集成在同一衬底上的可行性,采用正面刻蚀和背面ICP深刻蚀硅工艺实现红外发射元和探测单元的悬空热隔离结构,可以使红外发射源和探测器同时工作在较好的性能状态下。通过对红外气体传感器的红外发射源和探测单元的测试,表明两种单元均可以正常工作,验证了这种集成工艺的可行性。更多还原

【Abstract】 An integrated-infrared gas sensor chip including infrared emitter and detector based on MEMS technology is studied. It’s proved to be feasible that it can integrate infrared emitter and detector on the same substrate. It can ensure that infrared emitter and detector work under good condition through suspended micro-bridge structure by using positive etching and back ICP deep etching. The feasibility of this process is verified after the test of infrared emitter and detector.更多还原