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基于低频噪声的薄膜电阻器可靠性表征方法

Thin-film Resistor Reliability Characterization Based on Low Frequency Noise

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【作者】 吴勇马中发杜磊何亮

【Author】 WU Yong;MA Zhongfa;DU Lei;HE Liang;School of Microelectronics,Xidian University;School of Advanced Material and Nano-technology,Xidian University;

【机构】 西安电子科技大学微电子学院西安电子科技大学先进材料与纳米科技学院

【摘要】 薄膜电阻的低频噪声同器件的损伤程度密切相关。文中采用两级低噪声放大器和高速高精度PCI数据采集卡构建的测试系统测量了一组1.5 kΩ镍铬薄膜电阻老化试验前后的低频噪声,结合显微分析发现电迁移是薄膜电阻可靠性退化的主导机制,电迁移损伤发生前后低频噪声的幅值、频率指数和转折频率等参量均会发生异常波动。分析表明,低频噪声能更敏感地反映薄膜电阻的损伤程度,可作为此类器件可靠性无损的筛选依据。

【Abstract】 The low-frequency noise of thin-film resistor and its inner defects are closely related. In this paper,the low-frequency noises of a batch of 1. 5 kΩ Ni Cr thin-film resistors both before and after ageing are measured by a testing setup comprised of two-stage low-noise amplifiers and a high speed and high accuracy PCI data acquisition card. Electro-migration inside the thin-film resistor is identified to be the dominant degradation mechanism by a combination analysis of both low-frequency noise and microscopy. The parameters of low-frequency noise such as amplitude,frequency index and turning frequency exhibit unusual fluctuations right before the occurrence of electro-migration. It is concluded that the low-frequency noise of thin-film resistor can sensitively manifest the damages inside the component,and as a result,low-frequency noise can be used as an indicator for non-destructive screening.

  • 【文献出处】 电子科技 ,Electronic Science and Technology , 编辑部邮箱 ,2014年12期
  • 【分类号】TM544
  • 【被引频次】3
  • 【下载频次】133
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