【摘要】 介绍了CCGA封装的基本组成及焊柱的3种连接技术,对CCGA如何实现高互联密度、高性能、高可靠性的大尺寸封装进行了详细描述。CCGA板级装配的热循环试验结果表明CCGA封装技术达到甚至超过了典型卫星对航天电子设备可靠性的要求;CCGA散热时施加在器件顶部的压力超过极限值后将对可靠性产生严重影响。板级装配设计的关键要素和板级组装的关键工艺在文中也进行了概括性的叙述。更多还原

【Abstract】 The composition of ceramic column grid array package and three kind of column attach techniques have been introduced.How to realize large dimension package which have high interconnection density high electrical performance and high reliability are described particularly.The board-level thermal cycle testing proved that CCGA technology meets or exceeds the reliability requirements of typical satellite program applications.The compressive loads which bring pressure to bear on CCGA appear to have a large effect on reliability while it exceed the limit.The critical element of PCB pad design and critical process of board-level assembly are also presented更多还原