节点文献
微电子组(封)装技术的新发展
The New Development of Mico-Electronic Assembly and Packaging Technology
【摘要】 微组装技术的基础是SMT,实现了IC器件封装和板级电路组装这两个电路组装阶层之间技术上的融合,其发展方向是器件封装、组装与SMT自动化设备的紧密结合。微电子封装技术的基础是集成电路IC封装技术,发展方向是三维立体封装技术和微机电封装技术。重点论述了三维(3D)立体封装技术的最新发展,并介绍IC集成电路制造技术虚拟培训系统。
【Abstract】 the new development of mico-electronic assembly and packaging technology is described,including The IC Virtual Manufacturing Training System. The mico-electronic assembly technology based on SMT is achieved the amalgamation between the IC packaging and board circuit assembly,and is developed in the direction of combining the IC packaging with SMT equipment. The mico-electronic packaging technology based on IC packaging is developed in the direction of 3D packaging and mico-mechaelectronic packaging.
【关键词】 微电子组装；
三维(3D)立体封装；
IC集成电路；
虚拟培训；
【Key words】 Electronic assembly； Surface mounting technology SMT； Electronic Assembly； 3D packaging； Mico-mechaelectronic packaging.；
【Key words】 Electronic assembly； Surface mounting technology SMT； Electronic Assembly； 3D packaging； Mico-mechaelectronic packaging.；
- 【文献出处】 电子工业专用设备 ,Equipment for Electronic Products Manufacturing , 编辑部邮箱 ,2014年09期
- 【分类号】TN405
- 【被引频次】9
- 【下载频次】908