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模板法交流电沉积铜纳米线阵列及其表征
Alternating current electrodeposition of copper nanowire array by template method and its characterization
【摘要】 先通过二次阳极氧化法制备多孔阳极氧化铝膜模板,再采用交流电沉积法将Cu金属填入模板的纳米孔洞中得到铜纳米线阵列。分别采用扫描电镜、透射电镜和X射线衍射仪对Cu纳米线阵列的形貌和晶体结构进行表征。结果表明,多孔氧化铝模板的孔洞排布致密、均匀而有序。交流电沉积所得Cu纳米线为单晶结构,直径为60~90 nm,长度为0.5~4.0μm。
【Abstract】 A porous anodic alumina oxide(AAO) film template was prepared firstly by two-step anodization. The nanopores of the template were filled with Cu metal by alternating current electrodeposition to form a copper nanowire array. The morphology and crystal structure of the Cu nanowire array were characterized by scanning electron microscope, transmission electron microscope, and X-ray diffractometer, respectively. The results showed that the pores of the obtained porous AAO film template are distributed densely, uniformly, and orderly. The electrodeposited copper nanowire is single crystal-structured with a diameter of 60-90 nm and a length of 0.5-4.0 μm.
【Key words】 aluminum; anodization; template; alternating current electrodeposition; copper nanowire array; microstructure;
- 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2014年11期
- 【分类号】TB383.1
- 【被引频次】3
- 【下载频次】291