【摘要】 为了减少和避免镀金过程中剧毒物质氰、腈的使用,以巯基乙酸为配体合成了一种新型亚金配合物巯基乙酸亚金铵;采用试金法和元素分析仪分析了其成分,用红外光谱、紫外光谱、热失重分析和导电性测量等研究了其基本理化性质,并将其用于电镀金。结果表明:合成产物的分子式为NH4[Au(MA)2]·H2O,以巯基乙酸的巯基和金配位为成键特征,在200℃之前热稳定性较好;以NH4[Au(MA)2]·H2O为金源,通过四因素三水平的正交试验获得了最佳镀金参数:电流密度200~300 A/m2,光亮剂十二烷基磺酸钠浓度5~8 m L/L,温度35~50℃,金浓度15~25 g/L;所得电镀金层表面光滑,颗粒尺寸在0.5~1.0μm内为单质金,均匀性好,镀层色泽、结合力优良。更多还原

【Abstract】 A novel aurous ammonium thioglycolate was synthesized with thioglycolic acid as the ligand so as to replace highly toxic cyanogen and nitrite used for gold electroplating.The composition of as- synthesized product was determined by assaying method and elemental analysis method.The physicochemical properties of the product were investigated by infrared spectrometry,ultraviolet spectrometry,differential thermal analysis,and conductivity measurement.Moreover,as-synthesized product was used for gold electroplating,and the optimal electroplating parameters were determined by orthogonal tests covering three factors.Results indicated that the as-synthesized product had a formula of NH₄[Au（MA）₂]H₂O.The product was characterized by the covalenl bonding between Au（Ⅰ） and mercapla group,and it exhibited good thermal stability below 200℃.Moreover,the optimal electroplating parameters with NH₄[Au（MA）₂]·H₂O as the gold source were suggested as current density of 200 300A/m²,brightener concentration of 5—8 mL/L,temperature of35-50℃,and Au（Ⅰ） concentration of 15-25g/L.Resultant Au coating consisted of metallic Au grains with a size of 0.5-1.0 μm and was smooth and uniform,while it exhibited desired luster and good adhesion to the substrate.更多还原