【摘要】 采用AgCuInTi钎料在较低温度对Al2O3陶瓷与可伐合金(Kovar)进行焊接。研究了钎焊温度对于Al2O3/AgCuInTi/Kovar封接件抗拉强度及漏气速率的影响,采用扫描电子显微镜(SEM)、能谱分析(EDS)以及X射线衍射分析(XRD)对陶瓷与钎料反应界面进行分析,研究界面反应机制。结果表明:随着焊接温度的升高,抗拉强度先升高后降低,最高达780℃时的93 MPa,漏气速率有先变小后变大的趋势,最小漏气速率为810℃时的1.1×10-10Pa·m3·s-1;焊接界面清晰可辨,陶瓷与钎料层形成了明显的反应界面,元素Ti和Cu在界面处达到峰值;元素In促使钎料在较低温度熔化,同时与Ag作用形成了钎料层的基体相,在陶瓷与钎料反应界面附近与Cu作用生成Cu4In;活性元素Ti是实现Al2O3与AgCuInTi连接的关键,界面主要产物为TiO2,TiO,Cu3TiO4,Al3Ti,同时伴有单质Ag的生成。更多还原

【Abstract】 Al2O3 ceramic and Kovar were welded with AgCuInTi filler metal at lower temperatures.Effects of brazing temperature on tensile strength and leakage rate of Al2O3/AgCuInTi/Kovar sealing were investigated.The reaction interfaces of ceramic and brazing filler were analyzed by scanning electron microcopy(SEM),energy dispersive spectrometer(EDS),X-ray diffraction analysis(XRD),to study the interfacial reaction mechanism.The results show that with the welding temperature increasing,tensile strength increases until 93 MPa at 780 ℃,and then decreases;and leakage rate decreases until 1.1×10-10 Pa · m3 · s-1 at 810 ℃,and then increases.The welding interfaces are clear and legible.Reaction interface is formed clearly between ceramic and brazing filler,and elements Ti and Cu reach peak values in the interface.The element In prompts filler metal to melt at lower temperatures,meanwhile the matrix of the filler layer is formed by the reaction of In and Ag,and Cu4In is found near the interface between ceramic and filler metal,which is formed by the reaction of element Cu by the interface and element In.Active element Ti is the key to the connection between Al2O3 and AgCuInTi,and the interface is mainly the product of TiO2,TiO,Cu3TiO4,Al3Ti,accompanied by silver generation.更多还原