节点文献
气压及偏压对磁控溅射TaN薄膜力学性能影响
Growth and Property Characterization of Magnetron Sputtered TaN
【摘要】 采用电子回旋共振增强磁控溅射在不锈钢基体上制备六方相TaN薄膜,并研究了气压及偏压对TaN薄膜结构、力学性能的影响。利用X射线衍射、扫描电镜、原子力显微镜分析薄膜化学结构及形貌,利用纳米压痕、划痕实验仪对薄膜力学性能进行测定。研究表明,制备气压上升影响六方TaN相择优取向,气压、Ar/N2流量比及偏压改变对TaN薄膜力学性能有较大影响。实验证明在1.1×10-1Pa,偏压100V下制备的TaN薄膜具有最高硬度32.4 GPa,最高结合力极限载荷27 N。
【Abstract】 The TaN coatings were deposited by microwave enhanced reactive magnetron sputtering on stainless steel substrates.The impacts of the deposition conditions,such as the pressure,ratio of Ar/N2 gas flow rates and bias voltage,on the mechanical properties of the TaN coatings were evaluated.The TaN films were characterized with X-ray diffraction,scanning electron microscopy,and atomic force microscopy.The results show that the TaN coating improves the mechanical properties of the substrate,and that the deposition conditions strongly affect the microstructures and mechanical properties.The coatings,deposited on optimized conditions:a pressure of 1.1×10-1 Pa,a pulsed bias of 100 V,and Ar/N2 ratio of 4.5/1,display the highest micro-hardness,32.4 GPa,and a criticalload of 27 N.
【Key words】 Reactive magnetron sputtering; TaN films; Pressure; Bias; Mechanical properties;
- 【文献出处】 真空科学与技术学报 ,Chinese Journal of Vacuum Science and Technology , 编辑部邮箱 ,2013年01期
- 【分类号】O484.2
- 【被引频次】11
- 【下载频次】509