【摘要】 文中从应用开发MEMS产品的实用角度出发,介绍硅电容微差压敏感器件的封装工艺技术。文中给出了该器件的工作原理及结构特点,从封装的角度论述了固定极板的加工技术,并结合该器件的结构特点,讨论了适于小间隙、微结构芯片封装的等电位静电封接、双面同时静电封接等关键技术。该工艺技术已成功应用于硅电容微差压传感器的研制,效果良好,在结构型力敏器件的研制领域具有很好的推广应用价值。更多还原

【Abstract】 Electronic device packaging technologies are very important in MEMS products application. The packaging technologies,working principle and structure characteristic of the silicon capacitive micro-differential pressure sensitive device were introduced in this paper. The fixed plate processing technology,the equipotential electrostatic sealing technology suit for small gap,microstructure chip and the technology of the electrostatic sealed Simultaneously on both sides of the chip were discussed. The technology has been successfully applied to the development of the silicon capacitive differential pressure sensor and it has a promotional and application value in the development of the structural force-sensitive device.更多还原