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软木无胶胶合工艺研究

Processes of Self-bonding Corkboard

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【作者】 武再彦邱增处任博文郑超

【Author】 WU Zai-yan;QIU Zeng-chu;REN Bo-wen;ZHENG Chao;College of Mechanical and Electronic Engineering,Northwest A&F University;

【机构】 西北农林科技大学机械与电子工程学院

【摘要】 以探索新型环保的无胶软木产品为目的,在现有软木材料性质、结构的研究及木质材料自粘胶合理论基础之上,以热压时间、含水率、热压温度、配坯密度为因素,采用正交试验法进行软木无胶胶合工艺的研究。结果表明:软木材料可在一定条件下自粘合成板,且制成的无胶软木板性能优良。在实验条件下得到的较优软木无胶胶合工艺参数为:热压温度140℃,含水率12%,热压时间5min,配坯密度0.7g·cm-3。

【Abstract】 In order to explorer a new environmental friendly product of self-bonding cork,the process to produce the self-bonding cork board was investigated by the orthogonal test.This research was based on the study of the cork’s properties and the woody material self-bonding theory and four factors were examined such as hot-pressing time,moisture content,hot-pressing temperature,and the green density.According to the explosive experiment and the orthogonal test,we got good performance self-bonding cork boards and the optimum parameters were determined as:hot pressing at 140℃,moisture content of 12%,duration of 5minutes and green density of 0.7g·cm-3.

【关键词】 软木无胶胶合热压工艺
【Key words】 corkself-bondinghot-pressing process
【基金】 西北农林科技大学校长基金(A213020801)
  • 【文献出处】 西北林学院学报 ,Journal of Northwest Forestry University , 编辑部邮箱 ,2013年06期
  • 【分类号】TS653
  • 【被引频次】5
  • 【下载频次】224
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