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时效对热轧态Cu-Ni-Si-Mg合金组织和性能的影响

Effects of aging on microstructure and properties of hot-rolled Cu-Ni-Si-Mg alloy

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【作者】 王俊峰贾淑果陈少华刘平宋克兴

【Author】 WANG Jun-feng;JIA Shu-guo;CHEN Shao-hua;LIU Ping;SONG Ke-xing;School of Materials Science and Engineering,Henan University of Science and Technology;

【机构】 河南科技大学材料科学与工程学院

【摘要】 对经过连铸连轧的Cu-Ni-Si-Mg合金进行时效处理,研究了时效温度和时效时间对合金组织和性能的影响。结果表明:该合金经时效后,析出相呈弥散分布;在同一时效温度下,电导率在初期迅速上升,之后逐渐平缓;当时效时间相同时,时效温度越高,电导率越大。随着时效温度的升高,合金的显微硬度峰值越低,到达峰值所用的时间越短。热轧态Cu-Ni-Si-Mg合金经450℃时效2 h后,可以获得相对良好的综合性能,其显微硬度达到231 HV,电导率达到34%IACS。

【Abstract】 The Cu-Ni-Si-Mg alloy which was taken from compact strip production was treated by aging,the effects of aging temperature and aging time on microstructure and properties of the alloy were investigated. The results show that the secondary phase is distributed depressively in the alloy. The electric conductivity increases rapidly at first,and then inclines to be stable in the end at the same aging temperature; as the aging temperature rising,the electric conductivity increases at the same aging temperature,the highest peak hardness value of the alloy is lower,the time reaching the peak is shorter. Hot-rolled Cu-Ni-Si-Mg alloy had an excellent combination of microhardness and electrical conductivity after aging at 450 ℃ for 2 h,which can reach 231 HV and 34% IACS,respectively.

【关键词】 Cu-Ni-Si合金时效电导率显微硬度
【Key words】 Cu-Ni-Si alloyagingelectrical conductivitymicrohardness
【基金】 国家自然科学基金(51075122);河南省高校科技创新团队支持计划(2012IRTSTHN008);河南省高等学校青年骨干教师资助计划(09003047);河南科技大学科研创新培育基金(2010CZ0008)
  • 【文献出处】 材料热处理学报 ,Transactions of Materials and Heat Treatment , 编辑部邮箱 ,2013年S2期
  • 【分类号】TG156.92
  • 【被引频次】3
  • 【下载频次】149
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