【摘要】 通过向锡钎料中添加不同含量的Zn元素,系统研究了锌对SnxZn/Cu(x=0,0.2,0.5,0.8(质量分数,%))界面处柯肯达尔空洞形成的影响.结果表明,经热老化处理后,纯Sn/Cu接头中的Cu3Sn层和Cu3Sn/Cu界面出现了大量柯肯达尔空洞.然而随着Zn元素含量的增加,反应界面处的Cu3Sn层逐渐变薄甚至消失,柯肯达尔空洞也随之显著减少或消失;锌在反应界面处的富集现象越来越显著.锌参与了界面反应,形成了(Cu,Zn)6Sn5相、Cu6(Sn,Zn)5相和Cu-Zn固溶合金,其中Cu-Zn固溶合金层可以显著影响铜的界面扩散.Zn元素直接参与了界面扩散,在很大程度上缓和铜和锡的不平衡扩散,从而有效抑制了柯肯达尔空洞的形成.更多还原

【Abstract】 The effect of Zn on formation of Kirkendall voids on the interface was studied through the reaction between SnxZn solders(x=0,0.2%,0.5%,0.8%) and the electroplated Cu substrate.During the thermal aging of Sn/Cu joints,a number of Kirkendall voids were formed in the Cu3Sn layer and on the Cu3Sn/EPC interface.With the increase of Zn content in solder,the growth of Cu3Sn layer was greatly suppressed,and the formation of Kirkendall voids was effectively inhibited.The concentration of Zn on the reaction interface also significantly increased.Zn participated in the interface reaction,(Cu,Zn)6Sn5,Cu6(Sn,Zn)5 and Cu-Zn solid-solution alloy were formed,among which the Cu-Zn solid-solution alloy layer can greatly affect the diffusion of Cu.Zn served as a diffusing element during the interface reaction,which can improve the unbalanced diffusion of Cu and Sn to a great degree,and suppress the formation of voids effectively.更多还原