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非等温DSC法研究甲壳型液晶PBPCS改性环氧树脂的固化动力学
NON-ISOTHERMAL CURE KINETICS OF MESOGEN-JACKETED LIQUID CRYSTAL POLYMER PBPCS MODIFIED EPOXY RESIN
【摘要】 采用非等温DSC法对聚乙烯基对苯二甲酸二(对丁氧基苯酚)酯(PBPCS)/环氧树脂/甲基四氢苯酐固化体系的固化反应热行为以及固化动力学进行了研究,分别利用Kissinger和Ozawa动力学模型计算得到各体系固化反应的表观活化能,利用Crane模型计算出固化反应级数,得出了适于该树脂体系固化反应过程的动力学方程.结果表明该体系固化反应按照一级反应进行,PBPCS的加入不改变环氧树脂的固化机理,甲壳型液晶高分子PBPCS可以用于环氧树脂的改性研究.通过固化体系的DSC分析确定了体系固化工艺为90℃/2h→120℃/2h→140℃/1.5h,为聚乙烯基对苯二甲酸二(对丁氧基苯酚)酯/环氧树脂/甲基四氢苯酐体系的固化、性能测试和应用提供了理论依据,也为甲壳型液晶高分子改性环氧树脂的研究提供一定理论基础.
【Abstract】 Curing process and curing kinetics of poly { 2,5-bis[(4-butyloxyphenyl) oxycarbonyl] styrene / epoxy resin / methyl tetrahydrophthalic anhydride,PBPCS / E-51 / MeTHPA,systems were investigated by differential scanning calorimetry(DSC) using the non-isothermal method under different heating rates.Apparent activation energy of the curing systems was calculated by Kissinger method and Ozawa method respectively,and the reaction series were computed by means of Crane formula,then the kinetic equation was concluded.The results indicated that the curing process of the curing reactions followed the first order reaction,and the addition of PBPCS didn’t change the curing mechanism of epoxy resin.So mesogen-jacketed liquid crystal polymers could be used for the modification research of epoxy resin.Based on the data of DSC,the optimized curing process of the curing systems is 90 ℃ /2h →120 ℃ /2h →140 ℃ /1.5h.The results would provide a theoretical basis for curing,performance test and application of PBPCS / E-51 / MeTHPA systems,and for epoxy resins modified with mesogen-jacketed liquid crystal polymers.
【Key words】 Epoxy resin; Mesogen-jacked liquid crystal polymer; Cure kinetics; Modify;
- 【文献出处】 高分子学报 ,Acta Polymerica Sinica , 编辑部邮箱 ,2013年09期
- 【分类号】TQ323.5
- 【被引频次】27
- 【下载频次】841