【摘要】 采用Ag-Cu-Ti活性钎料钎焊金刚石/Cu复合材料和金刚石膜,实现其高强度连接。用SEM对接头的微观组织进行观察分析,用无损探伤检测钎焊质量,用拉伸试验测定接头的力学性能,用热循环试验检验其可靠性。结果表明:焊料与金刚石膜连接处有一层均匀连续的富Ti相,大大改善了焊料与金刚石膜的润湿性;与金刚石膜粗糙面相比,采用金刚石膜光滑面进行钎焊,焊接接头的质量较高,焊缝内存留的夹孔、气泡等缺陷较少,热导率较高;钎焊接头的抗拉强度>23.12MPa,能够承受50个周期的冷热循环,满足实际应用的要求。更多还原

【Abstract】 Ag-Cu-Ti active filler metal was used as the solder material to effectively achieve the high-strength connection between the diamond / Cu composites and diamond film. The microstructure, brazing quality and mechanical properties of the joint were characterized by SEM,ultrasonic non-destructive test and tensile test respectively. The reliability of the brazed joint was verified by thermal cycle experiments. The results show that by adding the active element Ti,a uniform continuous layer Ti-riched phase is determined at the joint between the solder and diamond film,which greatly improves the wettability of the solder and diamond film. The joint with high-quality, low defects and high thermal conductivity is obtained from the smooth diamond film rather than the rough diamond film. The maximum tensile strength of the joint is greater than 23. 12MPa and the joint can sustain 50 thermal cyclings,which can meet the requirements of practical application.更多还原