【摘要】 在电子设备寿命周期中,要经历各种环境载荷。我们需要综合考虑载荷对电子设备可靠性和寿命的影响。在该文中,以一块电路板为案例。建立整板模型,然后设定边界、分别加载温度和随机振动载荷。并利用有限元分析工具ANSYS计算,得出应力应变云值。最后基于Coffin-Manson疲劳寿命模型和线性叠加模型,分析和预测热循环和随机振动条件下,器件焊点疲劳寿命,为整板器件可靠性设计提供参考。更多还原

【Abstract】 In the life of electronic equipment,there are a variety of environmental load.The combined effects of environmental load are investigated.In the paper,we take a circuit board as a case.Create a model of the entire board,and then set the boundary,load temperature and random vibration loads.And calculate stress using FEM tool(ANSYS).Finally,based on the Coffin-Manson fatigue life model and a linear superposition model,predict solder joint fatigue life combined thermal and vibration condition.And provide a reference for the board level device reliability design.更多还原