【摘要】 3D NoC(Network-on-Chip)中,若连接层间相邻路由器的两组单向TSV(Through-Silicon Via)中有1组故障,数据便不能经该通道传输。为实现容错,提出一种在基于簇的3D NoC中添加冗余双向TSV的设计。任何1组单向TSV故障,都可通过配置这组双向TSV来替换,实现容错。在无故障TSV时,也可配置这组双向TSV来帮助传输数据包,实现数据的高速传输。与参考文献相比,实验表明,有TSV故障时该设计的平均延时至少减少了43.8%,且提高了系统可靠性。更多还原

【Abstract】 On the 3D NoC(Network-on-Chip),if one of the two groups of unidirectional TSVs(Through-Silicon Vias) in the adjacent routers between the layers has fault,the data would not be transmitted through this channel.A Fault-tolerant design of a cluster-based 3D NoC added redundant bidirectional TSVs is presented.A group of extra bidirectional TSVs,which could be dynamically configured between the unidirectional TSVs,was added to replace either of them which is faulted.What’s more,in the trouble-free case,the bidirectional TSVs could be configured to help transmit data packets to achieve high-speed data transmission.The experimental results demonstrate that the average packet transmission latency decreases by 43.8% at lest compared with the reference when some TSVs are fault,and the reliability of the system is improved.更多还原