节点文献
CCGA焊柱受力状态下热疲劳寿命的研究
FEM Analysis on Thermal Fatigue Life of CCGA Column Under Compressive Load
【摘要】 分析了CCGA器件在星载设备中的受力状态。采用非线性有限元分析方法和统一型粘塑性Anand本构方程,以CCGA组件焊柱为对象,建立了焊柱热应变损伤的三维有限元模型,并基于修正的Coffin-Manson方程,分析了力载荷对焊柱热疲劳寿命的影响。研究结果表明,力载荷在热循环条件下虽然对焊柱的应力影响不大,但对焊柱的塑性应变累积有明显的加剧作用,从而使焊柱的热疲劳寿命有显著降低,减少力载荷有利于提高焊柱的热疲劳寿命。
【Abstract】 Compressive load effect on CCGA devices for space applications is analyzed. CCGA column was regarded as a target, the nonlinear fnite element method and the unifed visco-pasctic Anand equation were employed to develop the 3D fnite element model base on hest strain damage. The effect of compressive load on thermal fatigue life was studied using a modifed Coffn-Manson relationship. Results indicate that compressive load does not appear to affect the equivalent stress under Thermal cycles, but fatigue life is signifcantly degraded with equivalent strain pick up cumulate by compressive load. Reduce compressive load can improve the fatigue life of CCGA column.
【Key words】 CCGA; Anand; Coffn-Manson; Thermal fatigue life; Finite element;
- 【文献出处】 电子工艺技术 ,Electronics Process Technology , 编辑部邮箱 ,2013年06期
- 【分类号】TN405
- 【被引频次】11
- 【下载频次】213