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电絮凝-生物吸附法处理电镀废水的研究
A Study of Treating Electroplating Wastewater by Electric Coagulation and Biosorption
【摘要】 以发酵工业常用的酵母菌为生物吸附剂,利用电絮凝和微生物联合处理混合电镀废水。探讨了电絮凝工艺在废水高浓度区及低浓度区的去除率,并通过实际的生产运行论证了工艺的适用性。采用电絮凝-微生物联合工艺处理混合电镀废水,对废水中重金属离子的去除率达到99.98%以上。
【Abstract】 A mixed electroplating wastewater was treated by an electric coagulation and biosorption joint process with the saccharomycete commonly used in fermentation industry as biological adsorbent.The removal rate of electric coagulation process in the wastewater high concentration zone and low concentration region was investigated.The applicability of the process was demonstrated through actual production run.When the electric coagulation and biosorption joint process is used to treat the mixed electroplating wastewater,the removal rate of heavy metal ions can reach more than 99.98%.
【基金】 湖南省重点学科建设项目(应用化学);湖南省自然科学基金项目(12JJ8004,13JJ4100);常德市科技计划项目(2012ZX17,2012ZX20)
- 【文献出处】 电镀与环保 ,Electroplating & Pollution Control , 编辑部邮箱 ,2013年05期
- 【分类号】X781.1
- 【被引频次】7
- 【下载频次】233