【摘要】 Al2O3p/Cu合金是具有优良物理性能和力学性能的新型结构-功能材料,在现代电子和电工领域有广阔的应用前景。综述了高强高导高软化温度Al2O3p/Cu合金的性能特点及制备方法。简述了国内外研究现状,分析了Al2O3p/Cu合金存在的问题,并展望了其今后的发展方向。更多还原

【Abstract】 Al2O3p/Cu alloy has a wide application prospect in the field of modern electronic and electrotechnics due to the excellent comprehensive physical and mechanical properties.Fabrication processes and characteristics of high strength,high conductivity and high softening temperature Al2O3p/Cu alloy are summarized.Research progress at home and abroad are reviewed.The existing problems of Al2O3p/Cu alloy are analyzed,and the prospect for the development of Al2O3p/Cu is made.更多还原