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微电子产品防静电包装材料的研究进展

Development Progress of Anti-static Packaging Material for Microelectronic Products

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【作者】 张晓玉袁玉珍

【Author】 ZHANG Xiao-yu,YUAN Yu-zhen(Shandong University of Technology,Zibo 255000,China)

【机构】 山东理工大学

【摘要】 首先叙述了防静电包装与防静电包装材料的概念,对微电子产品的防静电包装设计进行了介绍,并分别讨论了不同种类的抗静电包装材料的特点,简述了微电子产品包装国内外的发展情况,最后指出了微电子产品防静电包装的发展趋势与良好的市场前景。

【Abstract】 The concept of anti-static packaging and anti-static packaging material were first described.Anti-static packaging design for microelectronic products was introduced.The characteristics of different types of anti-static packaging material were discussed.Development status of anti-static packaging for microelectronic products at home and abroad was introduced.Development trend and market prospects of anti-static packaging for microelectronic products were put forward.

【基金】 山东理工大学重大横向课题(9002-109701)
  • 【文献出处】 包装工程 ,Packaging Engineering , 编辑部邮箱 ,2013年13期
  • 【分类号】TB484
  • 【被引频次】14
  • 【下载频次】541
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