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氮化铜薄膜制备中氮气比例对其结构及微观力学性能的影响
Effect of Nitrogen Partial Pressure on the Structure and Micro-mechanical Properties of Cu3 N Films
【摘要】 采用射频磁控溅射方法在玻璃基底上制备氮化铜薄膜,研究了氮氩混合气体中的氮气比例对薄膜择优生长取向、表面晶粒尺寸和微观力学性能的影响。结果表明:低氮气比例时,薄膜的纳米力学性能比较差;随着氮气比例的增加,氮化铜薄膜的择优生长晶面从(111)晶面转变为(100)晶面,晶粒尺寸变小,显微硬度增加,弹性模量则是先增加,后减小。
【Abstract】 Copper nitride thin films were prepared on silicon glass substrates by means of RF magnetron sputtering deposition,and then the effects of nitrogen partial pressure in a fixed-total N2-Ar mixture sputtering gas flow on the preferential crystalline orientation,the size of surface grain and micro-mechanical properties were investigated.It is showed that when the nitrogen partial pressure is low,the nano-mechanical property of the thin film is poor.As nitrogen partial pressure improves the preferential orientation transforms from plane(111) to plane(100),the crystalline grain size shrinks and the elastic modulus first increases but then decreases.
【Key words】 copper nitride thin film; r.f.magnetron sputtering; micro structure; nano-mechanical;
- 【文献出处】 表面技术 ,Surface Technology , 编辑部邮箱 ,2013年05期
- 【分类号】O484
- 【被引频次】3
- 【下载频次】120