节点文献
Ni(Pt) germanosilicide contacts formed on heavily boron doped Si1-xGex substrates for Schottky source/drain transistors
【摘要】 The electrical properties of Ni0:95Pt0:05-germanosilicide/Si1-xGex contacts on heavily doped p-type strained Si1-xGex layers as a function of composition and doping concentration for a given composition have been investigated.A four-terminal Kelvin-resistor structure has been fabricated by using the conventional complementary metal–oxide–semiconductor(CMOS) process to measure contact resistance.The results showed that the contact resistance of the Ni0:95Pt0:05-germanosilicide/Si1-xGex contacts slightly reduced with increasing the Ge fraction.The higher the doping concentration,the lower the contact resistivity.The contact resistance of the samples with doping concentration of 4 1019 cm-3 is nearly one order of magnitude lower than that of the samples with doping concentration of 5 1017 cm-3.In addition,the influence of dopant segregation on the contact resistance for the lower doped samples is larger than that for the higher doped samples.
【Abstract】 The electrical properties of Ni0:95Pt0:05-germanosilicide/Si1-xGex contacts on heavily doped p-type strained Si1-xGex layers as a function of composition and doping concentration for a given composition have been investigated.A four-terminal Kelvin-resistor structure has been fabricated by using the conventional complementary metal–oxide–semiconductor(CMOS) process to measure contact resistance.The results showed that the contact resistance of the Ni0:95Pt0:05-germanosilicide/Si1-xGex contacts slightly reduced with increasing the Ge fraction.The higher the doping concentration,the lower the contact resistivity.The contact resistance of the samples with doping concentration of 4 1019 cm-3 is nearly one order of magnitude lower than that of the samples with doping concentration of 5 1017 cm-3.In addition,the influence of dopant segregation on the contact resistance for the lower doped samples is larger than that for the higher doped samples.
【Key words】 specific contact resistivity; Ni(Pt) germanosilicide; Ge fraction; doping concentration;
- 【文献出处】 Journal of Semiconductors ,半导体学报(英文版) , 编辑部邮箱 ,2013年12期
- 【分类号】TN386
- 【下载频次】24