节点文献

Ni(Pt) germanosilicide contacts formed on heavily boron doped Si1-xGex substrates for Schottky source/drain transistors

  • 推荐 CAJ下载
  • PDF下载
  • 不支持迅雷等下载工具,请取消加速工具后下载。

【作者】 相文峰刘琨赵昆钟寿仙

【Author】 Xiang Wenfeng;Liu Kun;Zhao Kun;Zhong Shouxian;College of Science,China University of Petroleum;Beijing National Laboratory for Condensed Matter Physics,Institute of Physics,Chinese Academy of Sciences;

【机构】 College of Science,China University of PetroleumBeijing National Laboratory for Condensed Matter Physics,Institute of Physics,Chinese Academy of Sciences

【摘要】 The electrical properties of Ni0:95Pt0:05-germanosilicide/Si1-xGex contacts on heavily doped p-type strained Si1-xGex layers as a function of composition and doping concentration for a given composition have been investigated.A four-terminal Kelvin-resistor structure has been fabricated by using the conventional complementary metal–oxide–semiconductor(CMOS) process to measure contact resistance.The results showed that the contact resistance of the Ni0:95Pt0:05-germanosilicide/Si1-xGex contacts slightly reduced with increasing the Ge fraction.The higher the doping concentration,the lower the contact resistivity.The contact resistance of the samples with doping concentration of 4 1019 cm-3 is nearly one order of magnitude lower than that of the samples with doping concentration of 5 1017 cm-3.In addition,the influence of dopant segregation on the contact resistance for the lower doped samples is larger than that for the higher doped samples.

【Abstract】 The electrical properties of Ni0:95Pt0:05-germanosilicide/Si1-xGex contacts on heavily doped p-type strained Si1-xGex layers as a function of composition and doping concentration for a given composition have been investigated.A four-terminal Kelvin-resistor structure has been fabricated by using the conventional complementary metal–oxide–semiconductor(CMOS) process to measure contact resistance.The results showed that the contact resistance of the Ni0:95Pt0:05-germanosilicide/Si1-xGex contacts slightly reduced with increasing the Ge fraction.The higher the doping concentration,the lower the contact resistivity.The contact resistance of the samples with doping concentration of 4 1019 cm-3 is nearly one order of magnitude lower than that of the samples with doping concentration of 5 1017 cm-3.In addition,the influence of dopant segregation on the contact resistance for the lower doped samples is larger than that for the higher doped samples.

【基金】 Project supported by the National Natural Science Foundation of China(No.11004251);the Development Foundation of China University of Petroleum(Beijing)(No.01JB021)
  • 【文献出处】 Journal of Semiconductors ,半导体学报(英文版) , 编辑部邮箱 ,2013年12期
  • 【分类号】TN386
  • 【下载频次】24
节点文献中: 

本文链接的文献网络图示:

本文的引文网络