【摘要】 在接入网中,低成本、小尺寸的同轴结构封装10 Gb/s光接收组件起着非常重要的作用。在微波频段,封装器件引入的寄生参数已经成为制约其高频特性的主要因素之一。基于传输线理论,建立了包含芯片、金丝、管座的小信号等效电路模型。等效电路元件与实际封装器件有对应的关系。组件高频特性随元件参数值变化而变化。仿真结果表明金丝对其高频特性影响很严重。为了减小金丝电感,提出一种优化方案。并结合实际工艺条件,制作了样品,实验结果表明该样品的传输速率达到10 Gb/s,满足10 Gb/s光网络传输的要求。更多还原

【Abstract】 A 10 Gb/s receiver optical sub-assembly with transistor outline package plays an important role in the access network due to the attractive characteristics of low cost and small size.Its high-frequency characteristics are limited by the parasitic parameters of the packaging devices at microwave frequency bands.Based on the transmission line theory,a small signal equivalent circuit model including the chip,bonding wire and header were established.The elements of the equivalent circuit correspond to the practical packaging devices.The high-frequency characteristics of the receiver optical sub-assembly vary with the values of the elements.The simulation results show that the bonding wire becomes a serious effect on the high-frequency characteristics.In order to reduce the inductance of the bonding wire,an optimal solution was proposed.In considering a practical situation,a prototype was fabricated.The measurement result shows that the data rate is up to 10 Gb/s.Therefore,the proposed receiver optical sub-assembly can meet the requirements for the 10 Gb/s optical network transmission.更多还原